JPH01154668U - - Google Patents
Info
- Publication number
- JPH01154668U JPH01154668U JP5099088U JP5099088U JPH01154668U JP H01154668 U JPH01154668 U JP H01154668U JP 5099088 U JP5099088 U JP 5099088U JP 5099088 U JP5099088 U JP 5099088U JP H01154668 U JPH01154668 U JP H01154668U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- circuit board
- printed circuit
- board device
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 16
- 238000007598 dipping method Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5099088U JPH01154668U (en]) | 1988-04-18 | 1988-04-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5099088U JPH01154668U (en]) | 1988-04-18 | 1988-04-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01154668U true JPH01154668U (en]) | 1989-10-24 |
Family
ID=31277020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5099088U Pending JPH01154668U (en]) | 1988-04-18 | 1988-04-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01154668U (en]) |
-
1988
- 1988-04-18 JP JP5099088U patent/JPH01154668U/ja active Pending